Form In Place (FIP)

Toptronic dispenses in house form-in-place conductive and nonconductive elastomer gaskets on metal or plastic housings. The system applies programmed gasket beads with exceptional accuracy in three full axes, compensating for uneven surfaces in castings and molded parts to provide consistent, highly reliable seals. Gaskets can be applied on flanges as narrow as 0.6 mm, affording more space for board components or allowing smaller overall packaging. The conductive EMI Form In Place gaskets provide more than 75 dB attenuation from 200 MHz to 10 GHz and able to make a seal to IP67.

 TYPICAL APPLICATIONS

• Densely populated electronics packaging
• PCB inter-compartmental isolation with thin wall boundaries
• Castings, machined metal, and conductive plastic enclosures
• Transportation/Automotive sensor housing
• Military and Aerospace electronics
• Telecom
• Life Science

FEATURES/ BENEFITS

• Up to 60% reduced installation cost and nominal cost for production scale-up
• Up to 60% space savings within enclosures
• Excellent adhesion to common housing substrates
• Highly compressible gaskets, ideal for low closure force housings
• Quick turn-around of prototypes and samples 

TYPICAL PROPERTIES

• Filler Material: Ag/Cu; Ni/C; Ni/Al; Ag/Al, Ag Ag/Cu and Ni/C
• Base Material: Silicone
• Durometer: 38 (Shore A) to 80 (Shore A)
• Operating Temperature: up to 125ºC
• Thermal Conductivity: 0,9 to 2,2 W/m-K
• Shielding Level 90dB to 120dB at 2GHz