Thermally conductive interface pads are designed for use between heat generating components and their heat sinks. The materials conform to surface irregularities under moderate application pressures to fill air gaps and enhance heat transfer.
TYPICAL APPLICATIONS
Telecommunication equipment
Consumer electronics
Automotive electronics (ECUs)
LEDs, lightning
Power conversion
Desktop computers, labtops, servers
Handheld devices
Memory modules
FEATURES/ BENEFITS
Ultra low deflection force
High thermal conductivity accelerated age testing
Available in custom die-cut shapes, kiss-cut on sheets
TYPICAL PROPERTIES
Thickness in mm: 0,5 to 5,0mm – thicker versions available upon request