Toptronic dispenses in house form-in-place conductive and nonconductive elastomer gaskets on metal or plastic housings. The system applies programmed gasket beads with exceptional accuracy in three full axes, compensating for uneven surfaces in castings and molded parts to provide consistent, highly reliable seals. Gaskets can be applied on flanges as narrow as 0.6 mm, affording more space for board components or allowing smaller overall packaging. The conductive EMI Form In Place gaskets provide more than 75 dB attenuation from 200 MHz to 10 GHz and able to make a seal to IP67.
TYPICAL APPLICATIONS
Densely populated electronics packaging
PCB inter-compartmental isolation with thin wall boundaries
Castings, machined metal, and conductive plastic enclosures
Transportation/Automotive sensor housing
Military and Aerospace electronics
Telecom
Life Science
FEATURES/ BENEFITS
Up to 60% reduced installation cost and nominal cost for production scale-up
Up to 60% space savings within enclosures
Excellent adhesion to common housing substrates
Highly compressible gaskets, ideal for low closure force housings
Quick turn-around of prototypes and samples
TYPICAL PROPERTIES
Filler Material: Ag/Cu; Ni/C; Ni/Al; Ag/Al, Ag Ag/Cu and Ni/C