Phase-change Thermal Interface Materials completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.
TYPICAL APPLICATIONS
Microprocessors
Graphics processors
Chipsets
Memory modules
Power modules
Power semi conductors
FEATURES/ BENEFITS
Low thermal impedance
Proven solution – years of production use in personal computer OEM applications
Demonstrated reliability through thermal cycling and accelerated age testing
Available in custom die-cut shapes, kiss-cut on rolls
TYPICAL PROPERTIES
Thickness in mm: 0,115 to 0,152mm
Phase Transition Temperature in °C: 45-62 °C
Operating Temperature Range in ºC: -55 to +125ºC
Thermal Impedance, °C-in2/W (50 psi): 0,035 to 0,77 °C-in2/W