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+45 4919 2500
salg@toptronic.dk
Phase-Change Materials
Phase-change Thermal Interface Materials completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.
TYPICAL APPLICATIONS
- Microprocessors
- Graphics processors
- Chipsets
- Memory modules
- Power modules
- Power semi conductors
FEATURES/ BENEFITS
- Low thermal impedance
- Proven solution – years of production use in personal computer OEM applications
- Demonstrated reliability through thermal cycling and accelerated age testing
- Available in custom die-cut shapes, kiss-cut on rolls
TYPICAL PROPERTIES
- Thickness in mm: 0,115 to 0,152mm
- Phase Transition Temperature in °C: 45-62 °C
- Operating Temperature Range in ºC: -55 to +125ºC
- Thermal Impedance, °C-in2/W (50 psi): 0,035 to 0,77 °C-in2/W
- Voltage Breakdown Dry, VAC NA to 5KVA
