Gap-Pad (Gap-Filler)

Thermally conductive interface pads are designed for use between heat generating components and their heat sinks. The materials conform to surface irregularities under moderate application pressures to fill air gaps and enhance heat transfer.

TYPICAL APPLICATIONS

• Telecommunication equipment
• Consumer electronics
• Automotive electronics (ECUs)
• LEDs, lightning
• Power conversion
• Desktop computers, labtops, servers
• Handheld devices
• Memory modules

FEATURES/ BENEFITS

• Ultra low deflection force
• High thermal conductivity accelerated age testing
• Available in custom die-cut shapes, kiss-cut on sheets

TYPICAL PROPERTIES

• Thickness in mm: 0,5 to 5,0mm – thicker versions available upon request
• Operating Temperature Range in ºC: -55 to +200ºC
• Thermal Conductivity, W/m-K: 1,0 to 6,5 W/m-K
• Hardness, Shore 00: 4-75