+45 4919 2500

Thermal Products

Phase-Change Materials

Contact us

+45 4919 2500
salg@toptronic.dk

Phase-change Thermal Interface Materials completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.

TYPICAL APPLICATIONS

  • Microprocessors
  • Graphics processors
  • Chipsets
  • Memory modules
  • Power modules
  • Power semi conductors

FEATURES & BENEFITS

  • Low thermal impedance
  • Proven solution – years of production use in personal computer OEM applications
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • Available in custom die-cut shapes, kiss-cut on rolls

TYPICAL PROPERTIES

  • Thickness in mm: 0,115 to 0,152mm
  • Phase Transition Temperature in °C: 45-62 °C
  • Operating Temperature Range in ºC: -55 to +125ºC
  • Thermal Impedance, °C-in2/W (50 psi): 0,035 to 0,77 °C-in2/W
  • Voltage Breakdown Dry, VAC NA to 5KVA