Phase-Change Materials

Phase-change Thermal Interface Materials completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.

TYPICAL APPLICATIONS

• Microprocessors
• Graphics processors
• Chipsets
• Memory modules
• Power modules
• Power semi conductors

FEATURES & BENEFITS

• Low thermal impedance
• Proven solution – years of production use in personal computer OEM applications
• Demonstrated reliability through thermal cycling and accelerated age testing
• Available in custom die-cut shapes, kiss-cut on rolls

TYPICAL PROPERTIES

• Thickness in mm: 0,115 to 0,152mm
• Phase Transition Temperature in °C: 45-62 °C
• Operating Temperature Range in ºC: -55 to +125ºC
• Thermal Impedance, °C-in²/W (50 psi): 0,035 to 0,77 °C-in²/W
• Voltage Breakdown Dry, VAC NA to 5KVA