Thermally Conductive Gels

Gels are highly conformable, precured, single-component compounds. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

TYPICAL APPLICATIONS

• Automotive electronic control units (ECUs)
• Power conversion equipment
• Power supplies and uninterruptible power supplies
• Power semi conductors
• MOSFET arrays with common heat sinks
• Televisions and consumer electronics

FEATURES & BENEFITS

• Dispensable
• Fully cured
• Highly conformable at low pressures
• Single dispensable TIM can eliminate multiple pad part sizes/numbers
• Reworkable

TYPICAL PROPERTIES

• Able to fill Gaps: 0,1 to 2,5mm
• Operating Temperature Range in ºC: -55 to +200ºC
• Thermal Conductivity, W/m-K: 0,7 to 5,0
• Dielectric Strength (KVAC/mm): 8,0