Thermally Coductive Tapes

Thermal conductive interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners.

TYPICAL APPLICATIONS

• Mount heat sinks to components dissipating < ~25 W
• Attach heat sinks to PC (esp. graphics) processors
• Heat sink attachment to motor control processors
• Telecommunication infrastructure components

FEATURES & BENEFITS

• Offered in various forms to provide thermal, dielectric, and flame retardant properties
• Eliminates the need for mechanical attachment (i.e. screws, clips, rivets, fasteners)
• Proven reliability under various mechanical, thermal and environmental stresses
• No curing required, unlike epoxy or acrylic preforms or liquid systems
• Easily reworkable

TYPICAL PROPERTIES

• Thickness in mm: 0,127 to 0,25mm
• Operating Temperature Range in ºC: -50 to +150ºC
• Thermal Conductivity, W/m-K: 0,4 to 1,4 W/m-K
• Voltage Breakdown Dry, VAC NA to 5KVA