Thermal conductive interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners.
TYPICAL APPLICATIONS
Mount heat sinks to components dissipating < ~25 W
Attach heat sinks to PC (esp. graphics) processors
Heat sink attachment to motor control processors
Telecommunication infrastructure components
FEATURES/ BENEFITS
Offered in various forms to provide thermal, dielectric, and flame retardant properties
Eliminates the need for mechanical attachment (i.e. screws, clips, rivets, fasteners)
Proven reliability under various mechanical, thermal and environmental stresses
No curing required, unlike epoxy or acrylic preforms or liquid systems